Proceedings ... International Conference on Multichip Modules

Responsibility
sponsored by ISHM--the Microelectronics Society, the International Electronics Packaging Society ; in cooperation with IEEE/Components, Hybrids, and Materials Technology Section, IPC--the Institute for Interconnecting and Packaging Electronic Circuits ; endorsed by EIA--Electronic Industrial Association.
Imprint
Bellingham, Wash. : Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, c1995-
Physical description
v. : ill. ; 28 cm.
Series
Proceedings of SPIE--the International Society for Optical Engineering v. 2575; 2794

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Librarian view | Catkey: 3003476