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6. Using bump bonding to distribute current flow on a semiconductor power device

7. Multiple well drain engineering for HV MOS devices

10. Work function based voltage reference

12. METHOD FOR MANUFACTURING A MOS-FIELD EFFECT TRANSISTOR

13. USING BUMP BONDING TO DISTRIBUTE CURRENT FLOW ON A SEMICONDUCTOR POWER DEVICE

14. USING LOW PRESSURE EPI TO ENABLE LOW RDSON FET

15. ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET

16. VERTICAL DMOS-FIELD EFFECT TRANSISTOR

17. Work Function Based Voltage Reference

18. Temperature compensated work function based voltage reference

19. Temperature Compensated Work Function Based Voltage Reference

20. Work Function Based Voltage Reference

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